Here’s something I just noticed: the heatsink of the RK3588 module sits flush with the aluminum case’s lid. As a result, when the bottom plexiglass lid is screwed closed, it pushes the entire board upward, and the keyboard with it because of the standoff under the keyboard’s PCB. So both the keyboard and the plexiglass plate bulge out.
Anything I can do, short of 3D-printing a bottom cover with extra space for the heatsink?
There is some mechanical variance and it sounds in your case it’s a bit extreme. I’m working on a replacement heatsink that is thinner and simpler/cheaper to produce (simple geometry). We can send you one once that’s done.
I would appreciate that.
I might also make a sheetmetal bottom cover if I find the time. It would certainly let the heat out better than the plexiglass cover too. Although the transparent cover looks better.
When do you think you’ll have the new heatsinks?
I also have this issue. I removed the keyboard stabilizers, so there’s more space inside for the main board to flex into, for better or worse.
On the plus side the keyboard does not seem to be flexing while typing, even without the stabilizers 
I thought of doing that, but then I thought it would relieve the keyboard’s PCB, but at the expense of the CPU module PCB: it would bend twice as much.
So I left the spacers for now. That way the bending load is shared by both PCBs until I fix the problem one way or the other.
I would 3D-print a new bottom plate but neither PLA nor PETG would fare too well with the hot CPU module right against it, and I don’t have any other rigid filament.
I’m more and more thinking of making a new plexiglass plate out of thicker plexiglass and mill a pocket for the CPU heatsink - possibly with vent holes for good measure. But I have no time for that at the moment, and the Reform has taken entirely too much of my time in the past 24 hours already 
I modeled a 3D-printed spacer to drop the bottom 2 mm. It’s printing right now. If it works, I’ll post the model.
